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PCB专业英译术语
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PCB专业英译术语 一、 综合词汇 1、 印制电路:printed circuit 2、 印制线路:printed wiring 3、 印制板:printed board 4、 印制板电路:printed circuit board (PCB) 5、 印制线路板:printed wiring board(PWB) 6、 印制元件:printed component 7、 印制接点:printed contact 8、 印制板装配:printed board assembly 9、 板:board 10、 单面印制板:single-sided printed board(SSB) 11、 双面印制板:double-sided printed board(DSB) 12、 多层印制板:mulitlayer printed board(MLB) 13、 多层印制电路板:mulitlayer printed circuit board 14、 多层印制线路板:mulitlayer prited wiring board 15、 刚性印制板:rigid printed board 16、 刚性单面印制板:rigid single-sided printed borad 17、 刚性双面印制板:rigid double-sided printed borad 18、 刚性多层印制板:rigid multilayer printed board 19、 挠性多层印制板:flexible multilayer printed board 20、 挠性印制板:flexible printed board 21、 挠性单面印制板:flexible single-sided printed board 22、 挠性双面印制板:flexible double-sided printed board 23、 挠性印制电路:flexible printed circuit (FPC) 24、 挠性印制线路:flexible printed wiring 25、 刚性印制板:flex-rigid printed board, rigid-flex printed board 26、 刚性双面印制板:flex-rigid double-sided printed board, rigid-flex double-sided printed 27、 刚性多层印制板:flex-rigid multilayer printed board, rigid-flex multilayer printed board 28、 齐平印制板:flush printed board 29、 金属芯印制板:metal core printed board 30、 金属基印制板:metal base printed board 31、 多重布线印制板:mulit-wiring printed board 32、 陶瓷印制板:ceramic substrate printed board 33、 导电胶印制板:electroconductive paste printed board 34、 模塑电路板:molded circuit board 35、 模压印制板:stamped printed wiring board 36、 顺序层压多层印制板:sequentially-laminated mulitlayer 37、 散线印制板:discrete wiring board 38、 微线印制板:micro wire board 39、 积层印制板:buile-up printed board 40、 积层多层印制板:build-up mulitlayer printed board (BUM) 41、 积层挠印制板:build-up flexible printed board 42、 表面层合电路板:surface laminar circuit (SLC) 43、 埋入凸块连印制板:B2it printed board 44、 多层膜基板:multi-layered film substrate(MFS) 45、 层间全内导通多层印制板:ALIVH multilayer printed board 46、 载芯片板:chip on board (COB) 47、 埋电阻板:buried resistance board 48、 母板:mother board 49、 子板:daughter board 50、 背板:backplane 51、 裸板:bare board 52、 键盘板夹心板:copper-invar-copper board 53、 动态挠性板:dynamic flex board 54、 静态挠性板:static flex board 55、 可断拼板:break-away planel 56、 电缆:cable 57、 挠性扁平电缆:flexible flat cable (FFC) 58、 薄膜开关:membrane switch 59、 混合电路:hybrid circuit 60、 厚膜:thick film 61、 厚膜电路:thick film circuit 62、 薄膜:thin film 63、 薄膜混合电路:thin film hybrid circuit 64、 互连:interconnection 65、 导线:conductor trace line 66、 齐平导线:flush conductor 67、 传输线:transmission line 68、 跨交:crossover 69、 板边插头:edge-board contact 70、 增强板:stiffener 71、 基底:substrate 72、 基板面:real estate 73、 导线面:conductor side 74、 元件面:component side 75、 焊接面:solder side 76、 印制:printing 77、 网格:grid 78、 图形:pattern 79、 导电图形:conductive pattern 80、 非导电图形:non-conductive pattern 81、 字符:legend 82、 标志:mark [/size] 作者:ilww
16:18:00) 二、 基材: 1、 基材:base material 2、 层压板:laminate 3、 覆金属箔基材:metal-clad bade material 4、 覆铜箔层压板:copper-clad laminate (CCL) 5、 单面覆铜箔层压板:single-sided copper-clad laminate 6、 双面覆铜箔层压板:double-sided copper-clad laminate 7、 复合层压板:composite laminate 8、 薄层压板:thin laminate 9、 金属芯覆铜箔层压板:metal core copper-clad laminate 10、 金属基覆铜层压板:metal base copper-clad laminate 11、 挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film 12、 基体材料:basis material 13、 预浸材料:prepreg 14、 粘结片:bonding sheet 15、 预浸粘结片:preimpregnated bonding sheer 16、 环氧玻璃基板:epoxy glass substrate 17、 加成法用层压板:laminate for additive process 18、 预制内层覆箔板:mass lamination panel 19、 内层芯板:core material 20、 催化板材:catalyzed board ,coated catalyzed laminate 21、 涂胶催化层压板:adhesive-coated catalyzed laminate 22、 涂胶无催层压板:adhesive-coated uncatalyzed laminate 23、 粘结层:bonding layer 24、 粘结膜:film adhesive 25、 涂胶粘剂绝缘薄膜:adhesive coated dielectric film 26、 无支撑胶粘剂膜:unsupported adhesive film 27、 覆盖层:cover layer (cover lay) 28、 增强板材:stiffener material 29、 铜箔面:copper-clad surface 30、 去铜箔面:foil removal surface 31、 层压板面:unclad laminate surface 32、 基膜面:base film surface 33、 胶粘剂面:adhesive faec 34、 原始光洁面:plate finish 35、 粗面:matt finish 36、 纵向:length wise direction 37、 模向:cross wise direction 38、 剪切板:cut to size panel 39、 酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL) 40、 环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper CCL) 41、 环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates 42、 环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates 43、 环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates 44、 聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates 45、 聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates 46、 双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 47、 环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates 48、 聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates 49、 超薄型层压板:ultra thin laminate 50、 陶瓷基覆铜箔板:ceramics base copper-clad laminates 51、 紫外线阻挡型覆铜箔板:UV blocking copper-clad laminates 作者:ilww
16:19:00) 三、 基材的材料 1、 A阶树脂:A-stage resin 2、 B阶树脂:B-stage resin 3、 C阶树脂:C-stage resin 4、 环氧树脂:epoxy resin 5、 酚醛树脂:phenolic resin 6、 聚酯树脂:polyester resin 7、 聚酰亚胺树脂:polyimide resin 8、 双马来酰亚胺三嗪树脂:bismaleimide-triazine resin 9、 丙烯酸树脂:acrylic resin 10、 三聚氰胺甲醛树脂:melamine formaldehyde resin 11、 多官能环氧树脂:polyfunctional epoxy resin 12、 溴化环氧树脂:brominated epoxy resin 13、 环氧酚醛:epoxy novolac 14、 氟树脂:fluroresin 15、 硅树脂:silicone resin 16、 硅烷:silane 17、 聚合物:polymer 18、 无定形聚合物:amorphous polymer 19、 结晶现象:crystalline polamer 20、 双晶现象:dimorphism 21、 共聚物:copolymer 22、 合成树脂:synthetic 23、 热固性树脂:thermosetting resin 24、 热塑性树脂:thermoplastic resin 25、 感光性树脂:photosensitive resin 26、 环氧当量:weight per epoxy equivalent (WPE) 27、 环氧值:epoxy value 28、 双氰胺:dicyandiamide 29、 粘结剂:binder 30、 胶粘剂:adesive 31、 固化剂:curing agent 32、 阻燃剂:flame retardant 33、 遮光剂:opaquer 34、 增塑剂:plasticizers 35、 不饱和聚酯:unsatuiated polyester 36、 聚酯薄膜:polyester 37、 聚酰亚胺薄膜:polyimide film (PI) 38、 聚四氟乙烯:polytetrafluoetylene (PTFE) 39、 聚全氟乙烯丙烯薄膜:perfluorinated ethylene-propylene copolymer film (FEP) 40、 增强材料:reinforcing material 41、 玻璃纤维:glass fiber 42、 E玻璃纤维:E-glass fibre 43、 D玻璃纤维:D-glass fibre 44、 S玻璃纤维:S-glass fibre 45、 玻璃布:glass fabric 46、 非织布:non-woven fabric 47、 玻璃纤维垫:glass mats 48、 纱线:yarn 49、 单丝:filament 50、 绞股:strand 51、 纬纱:weft yarn 52、 经纱:warp yarn 53、 但尼尔:denier 54、 经向:warp-wise 55、 纬向:weft-wise, filling-wise 56、 织物经纬密度:thread count 57、 织物组织:weave structure 58、 平纹组织:plain structure 59、 坏布:grey fabric 60、 稀松织物:woven scrim 61、 弓纬:bow of weave 62、 断经:end missing 63、 缺纬:mis-picks 64、 纬斜:bias 65、 折痕:crease 66、 云织:waviness 67、 鱼眼:fish eye 68、 毛圈长:feather length 69、 厚薄段:mark 70、 裂缝:split 71、 捻度:twist of yarn 72、 浸润剂含量:size content 73、 浸润剂残留量:size residue 74、 处理剂含量:finish level 75、 浸润剂:size 76、 偶联剂:couplint agent 77、 处理织物:finished fabric 78、 聚酰胺纤维:polyarmide fiber 79、 聚酯纤维非织布:non-woven polyester fabric 80、 浸渍绝缘纵纸:impregnating insulation paper 81、 聚芳酰胺纤维纸:aromatic polyamide paper 82、 断裂长:breaking length 83、 吸水高度:height of capillary rise 84、 湿强度保留率:wet strength retention 85、 白度:whitenness 86、 陶瓷:ceramics 87、 导电箔:conductive foil 88、 铜箔:copper foil 89、 电解铜箔:electrodeposited copper foil (ED copper foil) 90、 压延铜箔:rolled copper foil 91、 退火铜箔:annealed copper foil 92、 压延退火铜箔:rolled annealed copper foil (RA copper foil) 93、 薄铜箔:thin copper foil 94、 涂胶铜箔:adhesive coated foil 95、 涂胶脂铜箔:resin coated copper foil (RCC) 96、 复合金属箔:composite metallic material 97、 载体箔:carrier foil 98、 殷瓦:invar 99、 箔(剖面)轮廓:foil profile 100、 光面:shiny side 101、 粗糙面:matte side 102、 处理面:treated side 103、 防锈处理:stain proofing 104、 双面处理铜箔:double treated foil 作者:ilww
16:20:00) 四、 设计 1、 原理图:shematic diagram 2、 逻辑图:logic diagram 3、 印制线路布设:printed wire layout 4、 布设总图:master drawing 5、 可制造性设计:design-for-manufacturability 6、 计算机辅助设计:computer-aided design.(CAD) 7、 计算机辅助制造:computer-aided manufacturing.(CAM) 8、 计算机集成制造:computer integrat manufacturing.(CIM) 9、 计算机辅助工程:computer-aided engineering.(CAE) 10、 计算机辅助测试:computer-aided test.(CAT) 11、 电子设计自动化:electric design automation .(EDA) 12、 工程设计自动化:engineering design automaton .(EDA2) 13、 组装设计自动化:assembly aided architectural design. (AAAD) 14、 计算机辅助制图:computer aided drawing 15、 计算机控制显示:computer controlled display .(CCD) 16、 布局:placement 17、 布线:routing 18、 布图设计:layout 19、 重布:rerouting 20、 模拟:simulation 21、 逻辑模拟:logic simulation 22、 电路模拟:circit simulation 23、 时序模拟:timing simulation 24、 模块化:modularization 25、 布线完成率:layout effeciency 26、 机器描述格式:machine descriptionm format .(MDF) 27、 机器描述格式数据库:MDF databse 28、 设计数据库:design database 29、 设计原点:design origin 30、 优化(设计):optimization (design) 31、 供设计优化坐标轴:predominant axis 32、 表格原点:table origin 33、 镜像:mirroring 34、 驱动文件:drive file 35、 中间文件:intermediate file 36、 制造文件:manufacturing documentation 37、 队列支撑数据库:queue support database 38、 元件安置:component positioning 39、 图形显示:graphics dispaly 40、 比例因子:scaling factor 41、 扫描填充:scan filling 42、 矩形填充:rectangle filling 43、 填充域:region filling 44、 实体设计:physical design 45、 逻辑设计:logic design 46、 逻辑电路:logic circuit 47、 层次设计:hierarchical design 48、 自顶向下设计:top-down design 49、 自底向上设计:bottom-up design 50、 线网:net 51、 数字化:digitzing 52、 设计规则检查:design rule checking 53、 走(布)线器:router (CAD) 54、 网络表:net list 55、 计算机辅助电路分析:computer-aided circuit analysis 56、 子线网:subnet 57、 目标函数:objective function 58、 设计后处理:post design processing (PDP) 59、 交互式制图设计:interactive drawing design 60、 费用矩阵:cost metrix 61、 工程图:engineering drawing 62、 方块框图:block diagram 63、 迷宫:moze 64、 元件密度:component density 65、 巡回售货员问题:traveling salesman problem 66、 自由度:degrees freedom 67、 入度:out going degree 68、 出度:incoming degree 69、 曼哈顿距离:manhatton distance 70、 欧几里德距离:euclidean distance 71、 网络:network 72、 阵列:array 73、 段:segment 74、 逻辑:logic 75、 逻辑设计自动化:logic design automation 76、 分线:separated time 77、 分层:separated layer 78、 定顺序:definite sequenc 作者:ilww
16:21:00) 五、 形状与尺寸: 1、 导线(通道):conduction (track) 2、 导线(体)宽度:conductor width 3、 导线距离:conductor spacing 4、 导线层:conductor layer 5、 导线宽度/间距:conductor line/space 6、 第一导线层:conductor layer No.1 7、 圆形盘:round pad 8、 方形盘:square pad 9、 菱形盘:diamond pad 10、 长方形焊盘:oblong pad 11、 子弹形盘:bullet pad 12、 泪滴盘:teardrop pad 13、 雪人盘:snowman pad 14、 V形盘:V-shaped pad 15、 环形盘:annular pad 16、 非圆形盘:non-circular pad 17、 隔离盘:isolation pad 18、 非功能连接盘:monfunctional pad 19、 偏置连接盘:offset land 20、 腹(背)裸盘:back-bard land 21、 盘址:anchoring spaur 22、 连接盘图形:land pattern 23、 连接盘网格阵列:land grid array 24、 孔环:annular ring 25、 元件孔:component hole 26、 安装孔:mounting hole 27、 支撑孔:supported hole 28、 非支撑孔:unsupported hole 29、 导通孔:via 30、 镀通孔:plated through hole (PTH) 31、 余隙孔:access hole 32、 盲孔:blind via (hole) 33、 埋孔:buried via hole 34、 埋/盲孔:buried /blind via 35、 任意层内部导通孔:any layer inner via hole (ALIVH) 36、 全部钻孔:all drilled hole 37、 定位孔:toaling hole 38、 无连接盘孔:landless hole 39、 中间孔:interstitial hole 40、 无连接盘导通孔:landless via hole 41、 引导孔:pilot hole 42、 端接全隙孔:terminal clearomee hole 43、 准表面间镀覆孔:quasi-interfacing plated-through hole 44、 准尺寸孔:dimensioned hole 45、 在连接盘中导通孔:via-in-pad 46、 孔位:hole location 47、 孔密度:hole density 48、 孔图:hole pattern 49、 钻孔图:drill drawing 50、 装配图:assembly drawing 51、 印制板组装图:printed board assembly drawing 52、 参考基准:datum referan 電路板朮語總整理 *****A***** Abietic Acid松脂酸. Abrasion Resistance耐磨性. Abrasives磨料,刷材. ABS樹脂. Absorption吸收(入). Ac Impedance交流阻抗. Accelerated Test(Aging)加速老化(試驗). Acceleration速化反應. Accelerator 加速劑,速化劑. Acceptability,Acceptance 允收性,允收. Access Hole露出孔,穿露孔. Accuracy准確度. Acid Number (Acid Value)酸值. Acoustic Microscope (AM)感音成像顯微鏡. Acrylic壓克力(聚丙烯酸樹脂). Actinic Light (or Intensity, or Radiation)有效光. Activation活化. Activator活化劑. Active Carbon活性炭. Active Parts(Devices)主動零件. Acutance解像銳利度. Addition Agent添加劑. Additive Process加成法. Adhesion附著力. Adhesion Promotor附著力促進劑. Adhesive膠類或接著劑. Admittance導納(阻抗的倒數). Aerosol噴霧劑,氣熔膠,氣懸體. Aging老化. Air Inclusion氣泡夾雜. Air Knife風刀. Algorithm演算法. Aliphatic Solvent脂肪族溶劑. Aluminium Nitride(AlN)氮化鋁. Ambient Tamp環境溫度. Amorphous無定形,非晶形. Amp-Hour安培小時. Analog Circuit/Analog Signal類比電路/類比訊號. Anchoring Spurs著力爪. Angle of Contack接觸角. Angle of Attack攻角. Anion陰離子. Anisotropic異向性,單向的. Anneal 韌化(退火). Annular Ring孔環. Anode陽極. Anode Sludge陽極泥. Anodizing陽極化. ANSI美國標準協會. Anti-Foaming Agent消泡劑. Anti-pit Agent抗凹劑. AOI自動光學檢驗. Apertures開口,鋼版開口. AQL品質允收水準. AQL(Acceptable Quality Level)允收品質水準. Aramid Fiber聚醯胺纖維. Arc Resistance耐電弧性. Array排列. Artwork底片. ASIC特定用途勣體電路器. Aspect Ratio縱橫比. Assembly組裝裝配. A-stage A階段. ATE自動電測設備. Attenuation訊號衰減. Autoclave壓力鍋. Axial-lead軸心引腳. Azeotrope共沸混合液. *****B***** Back Light (Back Lighting)背光法. Back Taper反錐斜角. Backpanels, Backplanes支撐板. Back-up 墊板. Balanced Transmission Lines平衡式傳輸線. Ball Grid Array球腳陣列(封裝). Bandability彎曲性. Banking Agent護岸劑. Bare Chip Assembly裸體晶片組裝. Barrel孔壁,滾鍍. Base Material基材. Basic Grid基本方格. Batch批. Baume波美度(凡液體比重比水重則 Be=145-(145÷Sp.Gr) 凡液體比重比水輕則 Be=140÷(Sp.Gr-130) *Sp.Gr 為比重即同體勣物質對"純水"1g/cm的比值). Beam lead光芒式的平行密集引腳. Bed-of-Nail Testing針床測試. Bellows Conact彈片式接觸. Beta Ray Backscatter貝他射線反彈散射. Bevelling切斜邊. Bias斜張綱布,斜纖法. Bi-Level Stencil]雙階式鋼板. Binder粘結劑. Bits頭(Drill Bits). Black Oxide黑氧化層. Blanking沖空斷開. Bleack 漂洗. Bleeding溢流. Blind Via Hole肓通孔. Blister局部性分層或起泡. Block Diagram電路系統塊圖 . Blockout封綱. Blotting干印. Blotting Paper吸水紙. Blow Hole吹孔. Blue Plaque藍紋(錫面鈍化層). Blur Edge (Circle)模糊邊帶(圈). Bomb Sight彈標. Bond Strength結合強度. Bondability結合性. Bonding Layer結合層接著層. Bonding Sheet(Layer)接合片. Bonding Wire結合線. Bow, Bowing板彎. Braid編線. Brazing硬焊(用含銀的銅鋅合金焊條). 在425℃~870℃下進行熔接的方式). Break Point顯像點. Break-away Panel可斷開板. Breakdown Voltage崩潰電壓. Break-out破出. Bridging搭橋. Bright Dip光澤浸漬處理. Brightener光澤劑. Brown Oxide棕氧化. Brush Plating刷鍍. B-stageB階段. Build Up Process增層法制程. Build-up堆積. Bulge鼓起. Bump 突塊. Bumping Process凸塊制程. Buoyancy浮力. Buried Via Hole埋導孔. Burn-in高溫加速老化試驗. Burning燒焦. Burr毛頭. Bus Bar匯電杆. Butter Coat 外表樹脂層. *****C***** C4 Chip JointC4晶片焊接. Cable電纜. CAD電腦輔助設計. Calendered Fabric軋平式綱布. Cap Lamination帽式壓合法. Capacitance電容. Capacitive Coupling電容耦合. Capillary Action毛細作用. Carbide碳化物. Carbon Arc Lamp碳弧燈. Carbon Treatment, Active活化炭處理. Card卡板. Card Cages/Card Racks電路板搆裝箱. Carlson Pin卡氏定位稍. Carrier載體. Cartridge濾心. Castallation堡型勣體電路器. Catalyzed Board, Catalyzed Substrate催化板材. Catalyzing催化. Cathode陰極. Cation陰向離子, 陽离子. Caul Plate隔板. Cavitation空泡化 半真空. Center-to-Center Spacing中心間距. Ceramics陶瓷. Cermet陶金粉. Certificate証明書. CFC氟氫碳化物. Chamfer倒角. Characteristic Impedance特性阻抗. Chase綱框. Check List檢查清單. Chelate螯合. Chemical Milling化學研磨. Chemical Resistance抗化性. Chemisorption化學吸附. Chip晶片(粒). Chip Interconnection晶片互連. Chip on Board晶片粘著板. Chip On Glass晶玻接裝(COG). Chisel鑽針的尖部. Chlorinated Solvent含氯溶劑,氯化溶劑. Circumferential Separation環狀斷孔. Clad/Cladding披覆. Clean Room無塵室. Cleanliness清潔度. Clearance余地,余環. Clinched Lead Terminal緊箝式引腳. Clinched-wire Through Connection通孔彎線連接法 . Clip Terminal繞線端接. Coat, Coating皮膜表層. Coaxial Cable同軸纜線. Coefficient of Thermal Expansion熱膨脹系數. Co-Firing共繞. Cold Flow冷流. Cold Solder Joint冷焊點. Collimated Light平行光. Colloid膠體. Columnar Structure柱狀組織. Comb Pattern梳型電路. Complex Ion錯離子. Component Hole零件孔. Component Orientation零件方向. Component Side組件面. Composites,(CEM-1,CEM-3)復合板材. Condensation Soldering凝熱焊接,液化放熱焊接. Conditioning整孔. Conductance導電. Conductive Salt導電鹽. Conductivity導電度. Conductor Spacing導體間距. Conformal Coating貼護層. Conformity吻合性, 服貼性. Connector連接器. Contact Angle接觸角. Contact Area接觸區. Contact Resistance接觸電阻. Continuity連通性. Contract Service協力廠,分包廠. Controlled Depth Drilling定深鑽孔. Conversion Coating 轉化皮膜. Coplanarity共面性. Copolymer共聚物. Copper Foil銅皮. Copper Mirror Test銅鏡試驗. Copper Paste銅膏. Copper-Invar-Copper (CIC)綜合夾心板. Core Material內層板材,核材. Corner Crack 通孔斷角. Corner Mark板角標記. Counterboring方型擴孔. Countersinking錐型擴孔. Coupling Agent 偶合劑. Coupon, Test Coupon板邊試樣. Coverlay/Covercoat表護層. Crack裂痕. Crazing白斑. Crease皺折. Creep潛變. Crossection Area截面積. Crosshatch Testing十字割痕試驗. Crosshatching十字交叉區. Crosslinking, Crosslinkage交聯,架橋. Crossover越交,搭交. Crosstalk雜訊, 串訊. Crystalline Melting Point晶體熔點. C-Stage C階段. Cure硬化,熟化. Current Density電流密度. Current-Carrying Capability載流能力. Curtain Coating濂塗法. *****D***** Daisy Chained Design菊瓣設計. Datum Reference基准參考. Daughter Board子板. Debris碎屑,殘材. Deburring去毛頭. Declination Angle斜射角. Definition邊緣逼真度. Degradation 劣化. Degrasing脫脂. Deionized Water去離子水. Delamination分離. Dendritic Growth 枝狀生長. Denier丹尼爾(是編織紡織所用各種紗類直徑單位, 定義9000米紗束所具有的重量(以克米計)). Densitomer透光度計. Dent凹陷. Deposition 皮膜處理. Desiccator干燥器. Desmearing去膠渣. Desoldering解焊. Developer顯像液,顯像機. Developing顯像 . Deviation偏差. Device電子元件. Dewetting縮錫. D-glassD玻璃. Diaze Film偶氮棕片. Dichromate重鉻 酸鹽. Dicing晶片分割. Dicyandiamide(Dicy)雙氰胺. Die 沖模. Die Attach晶粒安裝. Die Bonding晶粒接著. Die Stamping沖壓. Dielectric 介質. Dielectric Breakdown Voltage介質崩潰電壓. Dielectric Constant介質常數. Dielectric Strength介質強度. Differential Scanning Calorimetry(DSC)微差掃瞄熱卡分析法. Diffusion Layer擴散層. Digitizing數位化. Dihedral Angle雙反斜角. Dimensional Stability尺度安定性. Diode二極體. Dip Coating浸塗法. Dip Soldering浸焊法. DIP(Dual Inline Package)雙排腳封裝體. Dipole偶極,雙極. Direct / Indirect Stencil直接/間接版膜. Direct Emulsion直接乳膠. Direct Plating直接電鍍. Discrete Compenent散裝零件. Discrete Wiring Board散線電路板,復線板. Dish Down碟型下陷. Dispersant分散劑. Dissipation Factor散失因素. Disspation Factor散逸因子. Disturbed Joint受擾焊點. Doctor Blade修平刀,刮平刀. Dog Ear狗耳. Doping摻雜. Double Layer雙電層. Double Treated Foil雙面處理銅箔. Drag In / Drag Out帶[進/帶出. Drag Soldering拖焊. Drawbridging吊橋效應. Drift漂移. Drill Facet鑽尖切削面. Drill Pointer鑽針重磨機. Drilled Blank已鑽孔的裸板. Dross浮渣. Drum Side銅箔光面. Dry Film干膜. Dual Wave Soldering 雙波焊接. Ductility展性. Dummy Land假焊墊. Dummy, Dummying假鍍(片). Durometer橡膠硬度計. DYCOstrate電漿蝕孔增層法. Dynamic Flex(FPC)動態軟板. *****E***** E-Beam (Electron Beam)電子束. Eddy Current渦電流. Edge Spacing板邊空地. Edge-Board Connector板邊(金手指)承接器. Edge-Board Contact板邊金手指. Edge-Dip Solderability Test板邊焊錫性測試. EDTA乙二胺四乙酸. Effluent排放物. E-glass電子級玻璃. Elastomer彈性體. Electric Strength(耐)電性強度. Electrodeposition電鍍. Electro-deposition Photoresist電著光阻, 電泳光阻. Electroforming電鑄. Electroless-Deposition無電鍍. Electrolytic Tough Pitch電解銅.. Electrolytic-Cleaning電解清洗. Electro-migration電遷移. Electro-phoresis電泳動, 電滲. Electro-tinning鍍錫. Electro-Winning電解冶煉. Elongation 延伸性, 延伸率. Embossing凸出性壓花. EMF(Electromotive Force)電動勢. EMI(Electromagnetic Interference)電磁干擾. Emulsion乳化. Emulsion Side藥膜面. Encapsulating膠囊. Encroachment沾污,侵犯. End Tap封頭. Entek有機護銅處理. Entrapment夾雜物. Entry Material蓋板. Epoxy Resin環氧樹脂. Etch Factor蝕刻因子. Etchant蝕刻劑(液). Etchback回蝕. Etching Indicator蝕刻指標. Etching Resist蝕刻阻劑. Eutetic Composition共融組成. Exotherm放熱(曲線). Exposure曝光. Eyelet鉚眼. *****F***** Fabric綱布. Face Bonding反面朝下結合. Failure故障. Fan Out Wiring/Fan In Wiring扇出布線/扇入布線. Farad 法拉. Farady法拉第. Fatigue Strength抗疲勞強度. Fault缺陷. Fault Plane斷層面. Feed Through Hole導通孔. Feeder 進料器. Fiber Exposure玻纖顯露. Fiducial Mark基准記號. Filament纖絲. Fill緯向. Filler填充料. Fillet內圓填角. Film底片. Film Adhesive接著膜,粘合膜. Filter過濾器. Fine Line細線. Fine Pitch密腳距,密線距,密墊距. Fineness粒度, 純度. Finger手指. Finishing終修(飾). Finite Element Method有限要素分析法. First Article首產品. First Pass-Yield初檢良品率. Fixture夾具. Flair刃角變形. Flame Point自燃點. Flame Resistant耐燃性. Flammability Rate燃性等級. Flare扇形崩口. Flash Plating閃鍍. Flashover閃絡. Flat Cable扁平排線. Flat Pack扁平封裝(之零件). Flatness平坦度. Flexible Printed Circuit (FPC)軟板. Flexural Failure撓曲損壞. Flexural Module彎曲模數, 抗撓性模數 . Flexural Strength抗撓強度. Flip Chip覆晶,扣晶. Flocculation絮凝. Flood Stroke Print覆墨沖程印刷. Flow Soldering (Wave Soldering)流焊. Fluorescence熒光. Flurocarbon Resin碳氟樹脂. Flush Conductor嵌入式線路 , 貼平式 導體. Flush Point閃火點. Flute退屑槽. Flux助焊劑. Foil Burr銅箔毛邊. Foil Lamination銅箔壓板法. Foot殘足(干膜殘余物). Foot Print (Land Pattern)腳墊. Foreign Material 外來物,異物. Form-to-List布線說明清單. Four Point Twisting四點扭曲法. Free Radical自由基. Freeboard干舷. Frequency頻率. Frit 玻璃熔料. Fully-Additive Process全加成法. Fungus Resistance抗霉性. Fused Coating熔錫層. Fusing熔合. Fusing Fluid助熔液. *****G***** G-10由連續玻纖所織成的玻纖布與 環氧樹脂粘結劑所復合成的材料. Gage, Gauge量規. Gallium Arsenide (GaAs)砷化鎵. Galvanic Corrosion賈凡尼式腐蝕(電解式腐蝕). Galvanic Series賈凡尼次序(電動次序). Galvanizing鍍鋅. GAP第一面分離,長刃斷開. Gate Array閘列,閘極陣列. Gel Time膠化時間. Gelation Particle膠凝點. Gerber Data ,Gerber File格博檔案(是美商Gerber公司專為PCB面線路 圖形與孔位,所發展一系列完整的軟體檔案). Ghost Image陰影. Gilding鍍金 (現為:Glod Plating). Glass Fiber玻纖. Glass Fiber Protrusion/Gouging, Groove玻纖突出/挖破. Glass Transition Temperature, Tg玻璃態轉化溫度. Glaze釉面,釉料. Glob Top圓頂封裝體. Glouble Test球狀測試法. Glycol (Ethylene Glycol)乙二醇. Golden Board測試用標準板. Grain Size結晶粒度. Grass Leak 大漏. Grid標准格. Ground Plane /Earth Plane接地層. Ground Plane Clearance接地空環. Guide Pin導針. Gull /Wing Lead鷗翼引腳. *****H***** Halation環暈. Half Angle半角. Halide鹵化物. Haloing白圈,白邊. Halon海龍,是CFC"氟碳化物"的一種商品名. Hard Anodizing硬陽極化. Hard Chrome Plating鍍硬鉻. Hard Soldering硬焊. Hardener (Curing Agent)硬化劑(或Curing Agent). Hardness硬度. Haring-Blum Cell海固槽. Harness電纜組合. Hay Wire跳線. Heat Cleaning燒潔. Heat Dissipation散熱. Heat Distortion Point (Temp)熱變形點(溫度). Heat Sealing熱封. Heat Sink Plane散熱層. Heat Transfer Paste導熱膏. Heatsink Tool散熱工具. Hertz(Hz)赫. High Efficiency Particulate Air Filter (HEPA)高效空氣塵粒過瀘機. Hipot Test 高壓電測. Hi-Rel高度靠度. Hit 擊(鑽孔時鑽針每一次"刺下"的動作). Holding Time停置時間. Hole Breakout孔位破出. Hole Counter數孔機. Hole Density孔數密度. Hole Preparation通孔准備. Hole Pull Strength孔壁強度. Hole Void破洞. Hook 切削刀緣外凸. Hot Air Levelling噴錫. Hot Bar Soldering熱把焊接. Hot Gas Soldering熱風手焊. HTE(High Temperature Elongation)高溫延伸性. Hull Cell哈氏槽. Hybrid Integrated Circuit混成電路. Hydraulic Bulge Test液壓鼓起試驗. Hydrogen Embrittlement氫脆. Hydrogen Overvoltage氫過(超)電壓. Hydrolysis水解. Hydrophilic親水性. Hygroscopic吸溼性. Hypersorption超吸咐. *****I***** I.C. Socket勣體電路器插座. Icicle錫尖. Illuminance照度. Image Transfer影像轉移. Immersion Plating浸鍍. Impedance阻抗. Impedance Match阻抗匹配. Impregnate含浸. In-Circuit Testing組裝板電測. Inclusion異物,夾雜物. Indexing Hole基准孔. Inductance(L)電感. Infrared(IR)紅外線. Input/Output輸入/輸出. Insert, Insertion插接. Inspection Overlay套檢底片. Insulation Resistance絕緣電阻. Integrated Circuit(IC)勣體電路器. Inter Face介面. Interconnection互連. Intermetallic Compound (IMC)介面共化物. Internal Stress內應力. Interposer互邊導電物. Interstitial Via-Hole(IVH)局部層間導通孔. Invar殷鋼(63.8%Fe,36%Ni,0.2%C). Ion Cleanliness離子清潔度. Ion Exchange Resins離子交換樹脂. Ion Migration離子遷移. Ionizable (Ionic) Contaimination離子性污染. Ionization游離,電離. Ionization Voltage (Corona Level)電離化電壓(電纜內部狹縫空氣中,引起其 電離所施加之最小電壓). IPC美國印刷電路板協會. Isolation隔離性,隔絕性. *****J***** JEDEC(Joint Electronic Device 聯合電子元件工程委員會. Engineering Council) J-LeadJ型接腳. Job Shop專業工廠. Joule焦耳. Jumper Wire跳線. Junction接(合)面,接頭. Just-In-Time(JIT)適時供應,及時出現. *****K***** Kapton聚亞醯胺軟板. Karat克拉 (1克拉(鑽石)=0.2g 純金則24k金為 100%的鈍金. Kauri-Butanol Value考立丁醇值(簡稱K.B.值). Kerf.切形,裁剪. Kevlar聚醯胺纖維. Key電鍵 Key Board鍵盤. Kiss Pressure吻壓, 低壓. Knoop Hardness努普硬度. Known Good Die(KGD)已知之良好晶片. Kovar科伐合金(Fe53%,Ni29%,Co17%). Kraft Paper牛皮紙. *****L***** Lamda Wave延伸平波. Laminar Flow平流. Laminar Structure片狀結搆. Laminate Void板材空洞. Laminate(s)基板. Lamination Void壓合空洞. Laminator壓膜機. Land孔環焊墊,表面焊墊. Landless Hole無環通孔. Laser Direct Imaging (LDI)雷射直接成像. Laser Maching雷射加工法. Laser Photogenerator(LPG), Laser Photoplotter雷射曝光機. Laser Soldering雷射焊接法. Lay Back 刃角磨損. Lay Out布線,布局. Lay Up 疊合. Layer to Layer Spacing層間距離 Leaching焊散漂出,熔出. Lead 引腳. Lead Frame腳架. Lead Pitch腳距. Leakage Current漏電電流. Legend文字標記. Leveling整平. Lifted Land孔環(焊墊)浮起. Ligand錯離子附屬體. Light Emitting Diodes (LED)發光二極體. Light Integrator光能累積器. Light Intensity光強度. Limiting Current Density極限電流密度. Liquid Crystal Display (LCD)液晶顯示器. Liquid Dielectrics液態介質. Liquid Photoimagible Solder Mask, (LPSM)液態感光防焊綠漆. Local Area Network區域性網路. Logic 邏輯. Logic Circuit 邏輯電路. Loss Factor損失因素. Loss Tangent (TanδDK)損失正切. Lot Size批量. Luminance發光強度. Lyophilic親水性膠體. *****M***** Macro-Throwing Power巨觀分布力. Major Defect主要(嚴重)缺點. Major Weave Direction主要織向. Margin刃帶(鑽頭尖部). Marking標記. Mask阻劑. Mass Finishing大量整面(拋光). Mass Lamination大型壓板. Mass Transport質量輸送. Master Drawing主圖. Mat蓆(用于CEM-3(Composite Epoxy Material)的 復合材料.) Matte Side毛面(電鍍銅皮(ED Foil)之粗糙面). Mealing泡點. Mean Time To Failure (MTTF)故障前可用之平均時數. Measling白點. Mechanical Stretcher機械式張網機. Mechanical Warp機械式纏繞. Mechanism機理. Membrane Switch薄膜開關. Meniscograph Test弧面狀沾錫試驗. Meniscus彎月面. Mercury Vaper Lamp汞氣燈. Mesh Count綱目數. Metal Halide Lamp 金屬鹵素燈. Metallization金屬 化. Metallized Fabric金屬化綱布. Micelle微胞. Micro Wire Board微封線板. Micro-electronios微電子. Microetching微蝕. Microsectioning微切片法. Microstrip 微條. Microstrip Line微條線,微帶線. Microthrowing Power微分布力. Microwave微波. Migration遷移. Migration Rate遷移率. Mil英絲. Minimum Annular Ring孔環下限. Minimum Electrical Spacing電性間距下限. Minor Weave Direction次要織向. Misregistration 對不准度. Mixed Componmt Mounting Technology混合零件之組裝技術. Modem調變及解調器. Modification修改. Module模組. Modulus of Elasticity彈性系數. Moisture and Insulation Resistance Test溼氣與絕緣電阻試驗. Mold Release 脫模劑,離型劑. Mole摩爾. Monofilament單絲. Mother Board主機板,母板. Moulded Circuit模造立體電路機. Mounting Hole安裝孔. Mounting Hole組裝孔,機裝孔. Mouse Bite鼠齒(蝕刻后線路邊緣出現不規則缺口). Multi-Chip-Module(MCM)多晶片芯片模組. Multiwiring Board (or Discrete Wiring Board)復線板. *****N***** N.C.數值控制. Nail Head釘頭. Near IR近紅外線. Negative負片,鑽尖的第一面外緣變窄. Negative Etch-back反回蝕. Negative Stencil負性感光膜. Negative-Acting Resist負性作用之阻劑. Network綱狀元件. Newton牛頓. Newton Ring 牛頓環. Newtonian Liquid牛頓流體. Nick缺口. N-Methyl Pyrrolidine (NMP)N-甲基四氫嗶咯. Noble Metal Paste貴金屬印膏. Node節點. Nodule節瘤. Nomencleature標示文字符號. Nominal Cured Thickness標示厚度. Non-Circular Land非圓形孔環焊墊. Non-flammable非燃性. Non-wetting不沾錫. Normal Concentration (Strength)標準濃度,當量濃度. Normal Distribution常態分布. Novolac酯醛樹脂. Nucleation , Nucleating核化. Numerical Control數值控制. Nylon尼龍. *****O***** Occlusion吸藏. Off-Contact架空. Offset第一面大小不均. OFHC(Oxyen Free High Conductivity)無氧高導電銅. Ohm歐姆. Oilcanning蓋板彈動. OLB(Outer Lead Bond)外引腳結合. Oligomer寡聚物. Omega Meter離子污染檢測儀. Omega Wave振盪波. On-Contact Printing密貼式印刷. Opaquer不透明劑,遮光劑. Open Circuits斷線. Optical Comparater光學對比器(光學放大器.) Optical Density光密度. Optical Inspection光學檢驗. Optical Instrument光學儀器. Organic Solderability Preservatives (OSP)有機保焊劑. Osmosis滲透. Outgassing出氣,吹氣. Outgrowth懸出,橫出,側出. Output產出,輸出. Overflow溢流. Overhang總懸空. Overlap 鑽尖點分離. Overpotantial(Over voltage)過電位,過電壓. Oxidation氧化. Oxygen Inhibitor氧化抑制劑. Ozone Depletion臭氧層耗損. *****P***** Packaging封裝,搆裝. Pad焊墊,圓墊. Pad Master圓墊底片. Pads Only Board唯墊板. Palladium鈀. Panel制程板. Panel Plating全板鍍銅. Panel Process全板電鍍法. Paper Phenolic紙質酚醛樹脂(板材). Parting Agent脫膜劑. Passivation鈍化 ,鈍化外理. Passive Device (Component)被動元件(零件) Paste膏,糊. Pattern板面圖形. Pattern Plating線路電鍍. Pattern Process線路電鍍法. Peak Voltage峰值電壓. Peel Strength抗撕強度. Periodic Reverse (PR) Current周期性反電流. Peripheral周邊附屬設備. Permeability透氣性,導磁率. Permittivity誘電率,透電率. pH Value酸堿值. Phase相. Phase Diagram相圖. Phenolic酚醛樹脂. Photofugitive感光褪色. Photographic film感光成像之底片. Photoinitiator感光啟始劑. Photomask光罩. Photoplotter, Plotter光學繪圖機. Photoresist光阻. Photoresist Chemical Machinning (Milling)光阻式化學(銑刻)加工. Phototool底片. Pick and Place拾取與放置. Piezoelectric壓電性. Pin 插腳,插梢,插針. Pin Grid Array (PGA)矩陣式針腳對裝. Pinhole針孔. Pink Ring粉紅圈. Pitch跨距,腳距,墊距,線距. Pits凹點. Plain Weave平織. Plasma電漿. Plasticizers可塑劑,增塑劑. Plated Through Hole鍍通孔. Platen熱盤. Plating鍍. Plotting標繪. Plowing犁溝. Plug插腳,塞柱. Ply層,股. Pneumatic Stretcher氣動拉伸器. Pogo Pin伸縮探針. Point 鑽尖. Point Angle鑽尖面. Point Source Light點狀光源. Poise泊."粘滯度"單位=1dyne*sec/cm2. Polar Solvent極性溶劑. Polarity電極性. Polarization分極,極化. Polarizing Slot偏槽. Polyester Films聚酯類薄片. Polymer Thick Film (PTF)厚膜糊. Polymerization聚合. Polymide(PI)聚亞醯胺. Popcorn Effect爆米花效應. Porcelain瓷材,瓷面. Porosity Test疏孔度試驗. Positive Acting Resist正性光阻劑. Post Cure后續硬化,后烤. Post Separation后期分離,事后公離. Pot Life運用期,鍋中壽命. Potting鑄封,模封. Power Supply電源供應器. Preform 預制品. Preheat預熱. Prepreg膠片,樹脂片. Press Plate鋼板. Press-Fit Contact擠入式接觸. Pressure Foot 壓力腳. Pre-tinning預先沾錫. Primary Image線路成像. Print Through壓透,過度擠壓.. Probe探針. Process Camera制程用照像機. Process Window操作范圍. Production Master生產底片. Profile輪廓,部面圖,升溫曲線圖稜線. Propagation傳播. Propagation Delay傳播延遲. Puddle Effect水坑效應. Pull Away拉離. Pulse Plating脈沖電鍍法. Pumice Powder 浮石粉. Punch沖切. Purge, Purging淨空,淨洗. Purple Plague紫疫(金與鋁的共化物層). Pyrolysis熱裂解,高溫分解. *****Q***** Quad Flat Pack (QFP)方扁形封裝體. Qualification Agency資格認証機搆. Qualification Inspection資格檢驗. Qualified Products List合格產品(供應者)名單. Qualitative Analysis定性分析. Quality Conformance Test Circuitry (Coupon)品質符合之試驗線路(樣板). Quantitative Analysis定量分析. Quench 淬火,驟冷. Quick Disconnect快速接頭. Quill緯紗繞軸. *****R***** Rack 挂架. Radial Lead放射狀引腳. Radio Frequency Interference (RFI)射頻干擾. Rake Angle摳角,耙角. Rated Temperature, Voltage額定溫度,額定電壓. Reactance電抗. Real Estate底材面,基板面. Real Time System 即時系統. Reclaiming再生,再制. Rediometer輻射計,光度計. Reel to Reel卷輪(盤)式操作. Reference Dimension參考尺度. Reference Edge參考邊緣. Reflection反射. Reflow Soldering重熔焊接,熔焊. Refraction折射. Refractive Index折射率. Register Mark對准用標記. Registration對准度. Reinforcement補強物. Rejection剔退,拒收. Relamination(Re-Lam)多層板壓合. Relaxation松弛.緩和. Relay繼電器. Release Agent, Release Sheets脫模劑,離模劑. Reliability可靠度,可信度. Relief Angle浮角. Repair修理. Resin Coated Copper Foil背膠銅箔. Resin Content膠含量,樹脂含量. Resin Flow膠流量,樹脂流量. Resin Recession樹脂下陷. Resin Rich Area 多膠區,樹脂丰富區. Resin Smear膠(糊)渣. Resin Starve Area缺膠區,樹脂缺乏區. Resist阻膜,阻劑. Resistivity電阻系數,電阻率. Resistor電阻器,電阻. Resistor Drift電阻漂移. Resistor Paste電阻印膏. Resolution解像,解像度,解析度. Resolving Power解析(像)力,分辨力. Reverse Current Cleaning反電流(電解)清洗. Reverse Etchback反回蝕. Reverse Image負片影像(阻劑). Reverse Osmosis (RO)反(逆滲透). Reversion反轉,還原. Revision修正版.改訂版. Rework(ing)重工,再加工. Rhology流變學,流變性質. Ribbon Cable圓線纜帶. Rigid-Flex Printed Board硬軟合板. Ring 套環. Rinsing水洗,沖洗. Ripple紋波(指整流器所輸出電流中不穩定成分). Rise Time上升時間. Roadmap 線路與零件之布局圖. Robber輔助陰極. Roller Coating輥輪塗布. Roller Coating滾動塗布法. Roller Cutter輥切機. Roller Tinning輥錫法,滾錫法. Rosin松香. Rotary Dip Test擺動沾錫試驗. Routing切外型. Runout偏轉,累勣距差. Rupture迸裂. *****S***** Sacrificial Protection犧牲性保護層. Salt Spray Test鹽霧試驗. Sand Blast噴砂. Saponification皂化作用. Saponifier皂化劑. Satin Finish緞面處理. Scaled Flow Test比例流量實驗. Schemetic Diagram電路概略圖. ScoringV型刻槽. Scratch刮痕. Screen Printing綱版印刷. Screenability綱印能力. Scrubber磨刷機,磨刷器. Scum透明殘膜. Sealing封孔. Secondary Side第二面 . Seeding下種. Selective Plating選擇性電鍍. Self-Extinguishing自熄性. Selvage布邊. Semi-Additive Process半加成制程. Semi-Conductor半導體. Sensitizing敏化. Separable Component Part可分離式零件. Separator Plate隔板, 鋼板. Sequential Lamination接續性壓合法. Sequestering Agent螯合劑. Shadowing陰影,回蝕死角. Shank鑽針柄部. Shear Strength 抗剪強度. Shelf Life儲齡. Shield遮蔽. Shore Hardness蕭氏硬度. Short短路. Shoulder Angle肩斜角. Shunt分路. Side Wall側壁. Siemens電阻值. Sigma (Standard Deviation)標准差. Signal訊號. Silane硅烷. Silica Gel硅膠砂. Silicon硅. Silicone硅銅. Silk Screen綱版印刷,絲綱印刷. Silver Migration銀遷移. Silver Paste 銀膏. Single-In-Line Package(SIP)單邊插腳封裝體. Sintering燒結. Sizing上膠,上漿. Sizing上漿處理. Skin Effect集膚效應 (高頻下,電流在傳遞時多集中在導體 表面,使得道線內部通過電流甚少, 造成內部導體 浪費,并也使得表面導體部分電阻升高. Skip Printing, Skip Plating漏印,漏鍍. Skip Solder 缺錫, 漏焊. Slashing漿經. Sleeve Jint套接. Sliver邊絲,邊余. Slot, Slotting槽口. Sludge於泥. Slump塌散. Slurry稠漿,懸浮漿. Small Hole小孔. Smear膠渣. Smudging錫點沾污. Snap-off彈回高度. Socket插座. Soft Contact輕觸. Soft Glass 軟質玻璃(鉛玻璃). Solder焊錫. Solder Ball錫球. Solder Bridging錫橋. Solder Bump 焊錫凸塊. Solder Column Package錫柱腳封裝法. Solder Connection焊接. Solder Cost焊錫著層. Solder Dam錫堤. Solder Fillet填錫. Solder Levelling噴錫,熱風整平. Solder Masking(S/M)防焊膜綠漆. Solder Paste錫膏. Solder Plug錫塞(柱). Solder Preforms預焊料. Solder Projection焊錫突點. Solder Sag 焊錫垂流物. Solder Side焊錫面. Solder Spatter濺錫. Solder Splash賤錫. Solder Spread Test散錫試驗. Solder Webbing錫綱. Solder Webbing錫綱. Solder Wicking滲錫,焊錫之燈芯效應. Solderability可焊性. Soldering軟焊,焊接. Soldering Fluid, Soldering Oil助焊液,護焊油. Solid Content固體含量,固形分. Solidus Line固相線. Spacing間距. Span跨距. Spark Over閃絡. Specific Heat 比熱. Specification (Spec)規范,規格. Specimen樣品,試樣. Spectrophotometry分光光度計檢測法. Spindle主軸,鑽軸. Spinning Coating自轉塗布. Splay斜鑽孔. Spray Coating噴著塗裝. Spur底片圖形邊緣突出. Sputtering濺射. Squeege刮刀. Stagger Grid蹣跚格點. Stalagometer滴管式表面張力計. Stand-off Terminals直立型端子. Starvation缺膠. Static Eliminator靜電消除器. Steel Rule Die(鋼)刀模. Stencil版膜. Step and Repeat逐次重覆曝光. Step Plating梯階式鍍層. Step Tablet階段式曝光表. Stiffener補強條(板). Stop Off防鍍膜, 阻劑. Strain變形,應變. Strand絞(指由許多股單絲集束并旋扭而成的絲束). Stray Current迷走電流, 散雜電流(在電鍍槽系統中,其直流電 由整流器所提供,應在陽極板與被鍍件之間的匯 電杆與槽體液體中流通,但有時少部分電流也可能會 從槽體本身或加熱器上迷走,漏失). Stress Corrosion應力腐蝕. Stress Relief消除應力. Strike預鍍. Stringing拖尾. Stripline條線. Stripper剝除液(器). Substractive Process減成法. Substrate底材. Supper Solder超級焊錫. Supported Hole(金屬)支助通孔. Surface Energy表面能. Surface Insulation Resistance表面絕緣電阻. Surface Mount Device 表面粘裝元件. Surface Mounting Technology (SMT)表面粘裝技術. Surface Resistivity表面電阻率. Surface Speed鑽針表面速度. Surface Tension表面張力. Surfactant表面潤溼劑. Surge突流,突壓. Swaged Lead壓扁式引腳. Swelling Agents, Sweller膨松劑. Swimming 線路滑離. Synthetic Resin合成樹脂. *****T***** Tab接點,金手指. Taber Abraser泰伯磨試器. Tackiness粘著性, 粘手性. Tape Automatic Bonding (TAB)卷帶自動結合. Tape Casting 帶狀鑄材. Tape Test撕膠帶試驗. Tape Up Master原始手貼片. Taped Components卷帶式連載元件. Taper Pin Gauge錐狀孔規. Tarnish污化. Tarnish 污化, 污著. Teflon鐵氟龍(聚4氟乙烯). Telegraphing浮印,隱印. Temperature Profile溫度曲線. Template模板. Tensile Strength抗拉強度. Tensiomenter張力計. Tenting蓋孔法. Terminal端子. Terminal Clearance端子空環. Tetra-Etch氟樹脂蝕粗劑. Tetrafunctional Resin四功能樹脂. Thermal Coefficient of Expansion (TCE)熱膨脹系數. Thermal Conductivity導熱率. Thermal Cycling熱循環,熱震盪. Thermal Mismstch感熱失諧. Thermal Relief散熱式鏤空. Thermal Via導熱孔. Thermal Zone感熱區. Thermocompression Bonding熱壓結合. Thermocouple熱電偶. Thermode發熱體. Thermode Soldering熱模焊接法. Thermogravimetric Analysis, (TGA)熱重分析法. Thermomechanical Analysis (TMA)熱機分析法. Thermoplastic熱塑性. Thermosetting熱固性. Thermosonic Bonding熱超音波結合. Thermount聚醯胺短纖蓆材. Thermo-Via導熱孔. Thick Film Circuit厚膜電路. Thief輔助陽極. Thin Copper Foil薄銅箔. Thin Core薄基板. Thin Film Technology薄膜技術. Thin Small Outline Package(TSOP)薄小型勣體電路器. Thinner調薄劑. Thixotropy抗垂流性,搖變性. Three Point Bending三點壓彎試驗. Three-Layer Carrier三層式載體. Threshold Limit Value (TLV)極限值. Through Hole Mounting通孔插裝. Through Put物流量,物料通過量. Throwing Power分布力. Tie Bar分流條. Tin Drift錫量漂飄失. Tin Immersion浸鍍錫. Tin Pest錫疫(常見白色金屬錫為"β錫",當溫度低于13.2℃ 時則β錫將逐漸轉變成粉末狀灰色"α錫"稱為"錫疫". Tin Whishers錫須. Tinning熱沾焊錫. Tolerance公差. Tombstoning墓碑效應. Tooling Feature工具標示物. Topography表面地形. Torsion Strength抗扭強度. Touch Up觸修,簡修. Trace 線路,導線. Traceability追溯性,可溯性. Transducer轉能器. Transfer Bump移用式突塊. Transfer Laminatied Circuit轉壓式線路. Transfer Soldering移焊法. Transistor電晶體. Translucency半透性. Transmission Line傳輸線. Transmittance透光率. Treament, Treating含浸處理. Treeing枝狀鍍物,鍍須. Trim修整, 精修. Trim Line裁切線. Trimming修整,修邊. True Position真位. Tungsten鎢 Tungsten Carbide碳化鎢. Turnkey System包辦式系統. Turret Solder Terminal塔立式焊接端子. Twill Weave斜織法. Twist板扭. Two Layer Carrier兩層式載体. *****U***** UL Symbol(UL.為Under-Writers 保儉業試驗所標志. Laboratories,INC) Ultimate Tensile Strength (UTS)極限抗拉強度. Ultra High Frequency (UHF)超高頻率. Ultra Violet Curing (UV Curing)紫外線硬化. Ultrasonic Bonding超音波結合. Ultrasonic Cleaning超音波清洗. Ultrasonic Soldering超音波焊接. Unbalanced Transmission Line非平衡式傳輸線. Undercut, Undercutting側蝕. Underplate底鍍層. Universal Tester汛用型電測機. Unsupported Hole非鍍通孔. Urea尿素. Urethane胺基甲酸乙脂. *****V***** Vacuoles焊洞. Vacuum Evaporation(or Deposition)真空蒸鍍法. Vacuum Lamination真空壓合. Van Der Waals Force凡得華力. Vapor Blasting蒸汽噴砂. Vapor Degreasing蒸汽除油法. Vapor Phase Soldering氣相焊接. Varnish凡力水,清漆(樹脂之液態單體). V-cutV型切槽. Very Large-Scale Integration(VLSI)極大勣體電路器. Via Hole 導通孔. Vickers Hardness維氏硬度. Viscosity粘滯度,粘度. Vision Systems視覺系統. Visual Examination目視檢驗. Void 破洞,空洞. Volatile Content揮發份含量. Voltage電壓. Voltage Breakdown崩潰電壓. Voltage Drop 電壓降落. Voltage Efficiency電壓效率. Voltage Plane電壓層. Voltage Plane Clearance電壓層的空環. Volume Resistivity體勣電阻率. Volume Resistivity體勣電阻率. Volumetric Analysis容量分析法. Vulcanization交聯,硫化. *****W***** Wafer晶圓. Waive暫准過關,暫不檢查. Warp Size 漿經處理. Warp, Warpage板彎. Washer墊圈. Waste Treatment廢棄處理. Water Absorption吸水性. Water Break水膜破散,水破. Water Mark水印. Watt瓦特. Watts Bath瓦玆鍍鎳液. Wave Guide導波管. Wave Soldering波焊. Waviness 波紋,波度. Wear Resistance耐磨性,耐磨度. Weatherability耐候性. Weave Eposure織紋顯露. Weave Texture織紋隱現. Web蹼部. Wedge Bond 楔形結合點. Wedge Void楔形缺口(破口). Weft Yarn緯紗. Welding熔接. Wet Blasting溼噴砂. Wet Lamination溼壓膜法. Wet Process溼式制程. Wetting Agent潤溼劑. Wetting Balance沾錫天平. Wetting Balance沾錫,沾溼. Whirl Brush旋渦式磨刷法. Whirl Coating旋渦塗布法. Whisker晶須. White Residue白色殘渣. White Spot白點. Wicking燈蕊效應. Window操作范圍,傳動齒孔. Wiping Action 滑動接觸(導電). Wire Bonding打線結合. Wire Gauge線規. Wire Lead金屬線腳. Wire Pattern布線圖形. Wire Wrap繞線互連. Working Master工作母片. Working Time (Life)堪用時間. Workmanship 手藝,工藝水平,制作水準. Woven Cable扁平編線. Wrinkle皺折, 皺紋. Wrought Foil鍛碾金屬箔. *****X***** X AxisX軸. X-Ray X光. X-Ray FluorescenceX螢光. *****Y***** Yarn紗線. Y-AxisY軸. Yield良品率,良率,產率. Yield Point屈服點. *****Z***** Z-AxisZ軸. Zero Centering中心不變(疊合法). Zig-Zag In-Line Package (ZIP)鍊齒狀雙排腳封裝件
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