如何修改intel toolbox 修改版82571MAC地址

求linux下关于intel网卡rss内置hash算法相关资料
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求linux下关于intel网卡rss内置hash算法相关资料
[问题点数:200分,结帖人playmud]
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2012年9月 Linux/Unix社区大版内专家分月排行榜第二2012年7月 Linux/Unix社区大版内专家分月排行榜第二
2012年6月 Linux/Unix社区大版内专家分月排行榜第三2009年4月 硬件/嵌入开发大版内专家分月排行榜第三
匿名用户不能发表回复!|&>&intel网络芯片(等)e1000linux驱动源码
intel网络芯片(等)e1000linux驱动源码
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intel网络芯片(等)e1000linux驱动源码
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{%username%}回复{%com_username%}{%time%}\
/*点击出现回复框*/
$(".respond_btn").on("click", function (e) {
$(this).parents(".rightLi").children(".respond_box").show();
e.stopPropagation();
$(".cancel_res").on("click", function (e) {
$(this).parents(".res_b").siblings(".res_area").val("");
$(this).parents(".respond_box").hide();
e.stopPropagation();
/*删除评论*/
$(".del_comment_c").on("click", function (e) {
var id = $(e.target).attr("id");
$.getJSON('/index.php/comment/do_invalid/' + id,
function (data) {
if (data.succ == 1) {
$(e.target).parents(".conLi").remove();
alert(data.msg);
$(".res_btn").click(function (e) {
var parentWrap = $(this).parents(".respond_box"),
q = parentWrap.find(".form1").serializeArray(),
resStr = $.trim(parentWrap.find(".res_area_r").val());
console.log(q);
//var res_area_r = $.trim($(".res_area_r").val());
if (resStr == '') {
$(".res_text").css({color: "red"});
$.post("/index.php/comment/do_comment_reply/", q,
function (data) {
if (data.succ == 1) {
var $target,
evt = e || window.
$target = $(evt.target || evt.srcElement);
var $dd = $target.parents('dd');
var $wrapReply = $dd.find('.respond_box');
console.log($wrapReply);
//var mess = $(".res_area_r").val();
var mess = resS
var str = str.replace(/{%header%}/g, data.header)
.replace(/{%href%}/g, 'http://' + window.location.host + '/user/' + data.username)
.replace(/{%username%}/g, data.username)
.replace(/{%com_username%}/g, data.com_username)
.replace(/{%time%}/g, data.time)
.replace(/{%id%}/g, data.id)
.replace(/{%mess%}/g, mess);
$dd.after(str);
$(".respond_box").hide();
$(".res_area_r").val("");
$(".res_area").val("");
$wrapReply.hide();
alert(data.msg);
}, "json");
/*删除回复*/
$(".rightLi").on("click", '.del_comment_r', function (e) {
var id = $(e.target).attr("id");
$.getJSON('/index.php/comment/do_comment_del/' + id,
function (data) {
if (data.succ == 1) {
$(e.target).parent().parent().parent().parent().parent().remove();
$(e.target).parents('.res_list').remove()
alert(data.msg);
//填充回复
function KeyP(v) {
var parentWrap = $(v).parents(".respond_box");
parentWrap.find(".res_area_r").val($.trim(parentWrap.find(".res_area").val()));
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intel网络芯片(等)e1000linux驱动源码82574L性能怎么样,比82571EB和82576EB_百度知道
82574L性能怎么样,比82571EB和82576EB
我有更好的答案求助知道网友
4比1强一些,6比4强大多了。
82576GB比82576EB好在哪里呢
82574L是伪千兆的网卡芯片
200-300M82571EB/82576EB是真千兆网卡
82576GB呢 能跑满1G不掉包么
当然是浪漫的礼物喽! 有她的照片吗? 用她的照片为她订做个性拼图最重要...史上最有创意的礼物 用你们的照片和故事设计的报纸】报纸都知道吧,可是你...
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你可能喜欢Intel® 82575EB Gigabit Ethernet Controller Product Specifications
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Specifications
Product Collection
Operating Temperature Range
0°C to 55°C
Port Configuration
System Interface Type
PCIe v2.0 (2.5 GT/s)
Jumbo Frames Supported
Package Size
Low Halogen Options Available
Intel(R) Virtualization Technology for Connectivity (VT-c)
VMDq, I/OAT
Ordering and Compliance
Ordering Code
Ordering Code
Ordering Code
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Recommended Customer Price
Recommended Customer Price (RCP) is pricing guidance only for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice.
Prices may vary for other package types and shipment quantities. If sold in bulk, price represents individual unit. Listing of RCP does not constitute a formal pricing offer from Intel.
Fiber Channel over Ethernet
Fibre Channel over Ethernet (FCoE) is an encapsulation of Fibre Channel frames over Ethernet networks. This allows Fibre Channel to use 10 Gigabit Ethernet networks (or higher speeds) while preserving the Fibre Channel protocol.
MACsec IEEE 802.1 AE
802.1AE is the IEEE MAC Security (MACsec) standard which defines connectionless data confidentiality and integrity for media access independent protocols.
IEEE 1588, also knows as the Precision Time Protocol (PTP) is a protocol used to synchronize clocks throughout a computer network. On a local area network it achieves clock accuracy in the sub-microsecond range, making it suitable for measurement and control systems.
Pre Active: Orders may be taken, but not scheduled, nor shipped.
Active: This specific part is active.
End of Life: Product End of Life notification has been published.
Quality/Reliability Hold.
Reschedule
Retired Price: This specific part is no longer being manufactured or purchased and no inventory is available.
Retired: This specific part is no longer being manufactured or purchased and no inventory is available.
No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.
Obsolete: Inventory available. No future supplies will be available.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice.
The information herein is provided &as-is& and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed.
Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries.
Intel processors manufactured before January 1, 2013 are not confirmed conflict free.
The conflict free designation refers only to product manufactured after that date.
For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products.
Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice.
Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP
does not constitute a formal pricing offer from Intel.
Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios.
Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen:
Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product.
Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC
requirements.
The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
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